Publication:
Preparation and characterisation of electrodeposited Ni-Cu/Cu multilayers

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Date

2004-08

Authors

Alper, Mürsel

Authors

Baykul, M.Celalettin
Peter, Laszlo
Toth, J.
Bakonyi, I.

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Publisher

Springer

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Abstract

Ni-Cu/Cu multilayers have been, grown from a single electrolyte under potentiostatic conditions at different electrolyte pH values. The current-time transients recorded during deposition indicated different growth modes of the Ni-Cu layers. Structural characterisation by X-ray diffraction revealed that the multilayers have the same crystal structure and texture as their ( 1 0 0) textured polycrystalline Cu substrate. Scanning electron microscopy showed that the films grown at low pH (2.2) have smoother surfaces than those grown at high pH (3.0). Energy dispersive X-ray analysis revealed that the magnetic layers of the multilayers electrodeposited at high pH contain much more Cu compared to those deposited at low pH. Anisotropic magnetoresistance was found for nominal Cu layer thicknesses below 0.6 nm, and giant magnetoresistance (GMR) above 0.6 nm. The shape of the magnetoresistance curves for GMR multilayers indicated the predominance of a superparamagnetic contribution, possibly due to the discontinuous nature of the magnetic layer. For multilayers with the same bilayer and total thicknesses, the GMR magnitude decreased as the electrolyte pH increased. Besides possible structural differences, this may have come from a strong increase in the Cu content of the magnetic layers since this causes a nearly complete loss of ferromagnetism at room temperature.

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Keywords

Electrodeposition, Electrolyte pH, GMR, Ni-Cu/Cu multilayers, Superparamagnetism, Potential wave-forms, Giant magnetoresistance, Co/Cu multilayers, Cu alloys, Anisotropy, Crystal structure, Superlattices, Microstructure, Films, Ferromagnetism, Magnetoresistance, Multilayers, pH effects, Scanning electron microscopy, X ray diffraction analysis, Anisotropic magnetoresistance, Electrochemistry

Citation

Alper, M. vd. (2004). “Preparation and characterisation of electrodeposited Ni-Cu/Cu multilayers”. Journal of Applied Electrochemistry, 34(8), 841-848.

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