Yayın: The effect of ferromagnetic and non-ferromagnetic layer thicknesses on the electrodeposited CoFe/Cu multilayers
Tarih
Kurum Yazarları
Tekgül, Atakan
Alper, Mürsel
Haciismailoğlu, Mürşide
Yazarlar
Kockar, Hakan
Danışman
Dil
Türü
Yayıncı:
Springer
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Özet
A series of CoFe/Cu multilayer was electrodeposited as a function of ferromagnetic and non- ferromagnetic layer thicknesses on Ti substrates from a single electrolyte containing Co (from CoSO4), Fe (from FeSO4), Cu (from CuSO4) metal ions under potentiostatic control. The deposition was carried out in a three electrode cell at room temperature. The Cu and CoFe layers were deposited at a cathode potential of -0.3 and -1.5 V with respect to saturated calomel electrode respectively. The structural studies by X-ray diffraction revealed that the multilayers have face-centered-cubic structure. The magnetic characteristics of the films were investigated using a vibrating sample magnetometer and their easy-axis was found to be in the film plane. Magnetoresistance measurements were carried out at room temperature with magnetic fields up to +/- 955 kA/m using the Van der Pauw method. All multilayers exhibited giant magnetoresistance (GMR). The GMR values up to 22 % and a GMR sensitivity of 52 % per 1 kA/m were obtained.
Açıklama
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Konusu
Engineering, Materials science, Physics, Giant magnetoresistance, Magnetic-structures, Exchange, Films, Superlattices, Sensors, Alloys, Binary alloys, Cobalt alloys, Cobalt metallography, Copper, Copper compounds, Electrodeposition, Electrodes, Electrolytes, Ferromagnetic materials, Ferromagnetism, Iron compounds, Metal ions, Multilayers, Face centered cubic structure, GMR, Magnetic characteristic, Magnetoresistance measurements, Potentiostatic control, Saturated calomel electrode, Three electrode cells, Vibrating sample magnetometer, Sulfur compounds
Alıntı
Tekgül, A. vd. (2015). "The effect of ferromagnetic and non-ferromagnetic layer thicknesses on the electrodeposited CoFe/Cu multilayers". Journal of Materials Science - Materials in Electronics, 26(4), 2411-2417.