Publication:
Computational thermal analysis of cylindrical fin design parameters and a new methodology for defining fin structure in LED automobile headlamp cooling applications

dc.contributor.authorSökmen, Kemal Furkan
dc.contributor.authorYürüklü, Emrah
dc.contributor.buuauthorYamankaradeniz, Nurettin
dc.contributor.departmentTeknik Bilimler Meslek Yüksekokulu
dc.contributor.departmentİklimlendirme ve Soğutma Programı
dc.contributor.researcheridAAA-1753-2021
dc.contributor.scopusid26645227400
dc.date.accessioned2022-12-02T07:40:58Z
dc.date.available2022-12-02T07:40:58Z
dc.date.issued2015-10-15
dc.description.abstractIn this study, the effects of fin design, fin material, and free and forced convection on junction temperature in automotive headlamp cooling applications of LED lights are researched by using ANSYS CFX 14 software. Furthermore a new methodology is presented for defining the optimum cylindrical fin structure within the given limits. For measuring the performance of methodology, analyses are carried out for various ambient temperatures (25 degrees C, 50 degrees C and 80 degrees C) and different LED power dissipations (0.5 W, 0.75 W, 1 W and 1.25 W). Then, analyses are repeated at different heat transfer coefficients and different fin materials in order to calculate LED junction temperature in order to see if the fin structure proposed by the methodology is appropriate for staying below the given safety temperature limit. As a result, the suggested method has always proposed proper fin structures with optimum characteristics for given LED designs. As another result, for safe junction temperature ranges, it is seen that for all LED power dissipations, adding aluminum or copper plate behind the printed circuit board at low ambient temperatures is sufficient. Also, as the ambient temperature increases, especially in high powered LED lights, addition of aluminum is not sufficient and fin usage becomes essential. High heat transfer coefficient and using copper fin affect the junction temperature positively.
dc.description.sponsorshipMagneti Marelli SpA
dc.identifier.citationSökmen, K. F. vd. (2016). "Computational thermal analysis of cylindrical fin design parameters and a new methodology for defining fin structure in LED automobile headlamp cooling applications". Applied Thermal Engineering, 94, 534-542.
dc.identifier.endpage542
dc.identifier.issn1359-4311
dc.identifier.scopus2-s2.0-84947997375
dc.identifier.startpage534
dc.identifier.urihttps://doi.org/10.1016/j.applthermaleng.2015.10.069
dc.identifier.urihttps://www.sciencedirect.com/science/article/pii/S1359431115011163
dc.identifier.urihttp://hdl.handle.net/11452/29651
dc.identifier.volume94
dc.identifier.wos000370770300055
dc.indexed.wosSCIE
dc.language.isoen
dc.publisherElsevier
dc.relation.collaborationYurt içi
dc.relation.journalApplied Thermal Engineering
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.subjectThermodynamics
dc.subjectEnergy & fuels
dc.subjectEngineering
dc.subjectMechanics
dc.subjectAutomotive LED lighting systems
dc.subjectLaminar natural convection
dc.subjectHeat sinks
dc.subjectComputational fluid dynamics (CFD)
dc.subjectAluminum
dc.subjectApplication programs
dc.subjectComputational fluid dynamics
dc.subjectCopper
dc.subjectElectric losses
dc.subjectFins (heat exchange)
dc.subjectHeadlights
dc.subjectHeat transfer
dc.subjectHeat transfer coefficients
dc.subjectPrinted circuit boards
dc.subjectPrinted circuits
dc.subjectStructural optimization
dc.subjectTemperature
dc.subjectThermoanalysis
dc.subjectCooling applications
dc.subjectHigh heat transfers
dc.subjectJunction temperatures
dc.subjectLED lighting system
dc.subjectLow ambient temperatures
dc.subjectTemperature increase
dc.subjectTemperature limits
dc.subjectLight emitting diodes
dc.subject.scopusPower Semiconductor Diodes; Heat Sinks; Hot Temperature
dc.subject.wosThermodynamics
dc.subject.wosEnergy & fuels
dc.subject.wosEngineering, mechanical
dc.subject.wosMechanics
dc.titleComputational thermal analysis of cylindrical fin design parameters and a new methodology for defining fin structure in LED automobile headlamp cooling applications
dc.typeArticle
dc.wos.quartileQ2
dspace.entity.typePublication
local.contributor.departmentTeknik Bilimler Meslek Yüksekokulu/İklimlendirme ve Soğutma Programı
local.indexed.atScopus
local.indexed.atWOS

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