Publication:
The role of ITO resistivity on current spreading and leakage in InGaN/GaN light emitting diodes

dc.contributor.authorSheremet, V.
dc.contributor.authorGenç, M.
dc.contributor.authorElçi, M.
dc.contributor.authorSheremet, Nina
dc.contributor.authorAltuntaş, İsmail
dc.contributor.authorDing, Kai
dc.contributor.authorAvrutin, Vitaliy
dc.contributor.authorÖzgür, Ümit
dc.contributor.authorMorkoç, Hadis
dc.contributor.buuauthorAydınlı, Atilla
dc.contributor.departmentMühendislik Fakültesi
dc.contributor.departmentElektrik ve Elektronik Mühendisliği Bölümü
dc.contributor.researcheridABI-7535-2020
dc.contributor.scopusid7005432613
dc.date.accessioned2023-01-04T12:22:49Z
dc.date.available2023-01-04T12:22:49Z
dc.date.issued2017-08-08
dc.description.abstractThe effect of a transparent ITO current spreading layer on electrical and light output properties of blue InGaN/GaN light emitting diodes (LEDs) is discussed. When finite conductivity of ITO is taken into account, unlike in previous models, the topology of LED die and contacts are shown to significantly affect current spreading and light output characteristics in top emitting devices. We propose an approach for calculating the current transfer length describing current spreading. We show that an inter-digitated electrode configuration with distance between the contact pad and the edge of p-n junction equal to transfer length in the current spreading ITO layer allows one to increase the optical area of LED chip, as compared to the physical area of the die, light output power, and therefore, the LED efficiency for a given current density. A detailed study of unpassivated LEDs also shows that current transfer lengths longer than the distance between the contact pad and the edge of p-n junction leads to increasing surface leakage that can only be remedied with proper passivation.
dc.identifier.citationSheremet, V. vd. (2017). ''The role of ITO resistivity on current spreading and leakage in InGaN/GaN light emitting diodes''. Superlattices and Microstructures, 111, 1177-1194.
dc.identifier.endpage1194
dc.identifier.issn0749-6036
dc.identifier.scopus2-s2.0-85029516809
dc.identifier.startpage1177
dc.identifier.urihttps://doi.org/10.1016/j.spmi.2017.08.026
dc.identifier.urihttps://www.sciencedirect.com/science/article/pii/S0749603617314416
dc.identifier.urihttp://hdl.handle.net/11452/30256
dc.identifier.volume111
dc.identifier.wos000415768800128
dc.indexed.wosSCIE
dc.language.isoen
dc.publisherElsevier
dc.relation.collaborationYurt içi
dc.relation.collaborationSanayi
dc.relation.collaborationYurt dışı
dc.relation.journalSuperlattices and Microstructures
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi
dc.relation.tubitak113G042
dc.rightsinfo:eu-repo/semantics/openAccess
dc.subjectPhysics
dc.subjectCurrent spreading
dc.subjectIndium tin oxide
dc.subjectInGaN/GaN multiple quantum well
dc.subjectLED
dc.subjectTransparent conductive electrodes
dc.subjectEfficiency droop
dc.subjectSemiconductors
dc.subjectContacts
dc.subjectGallium alloys
dc.subjectIndium alloys
dc.subjectSemiconducting indium compounds
dc.subjectSemiconductor junctions
dc.subjectSemiconductor quantum wells
dc.subjectTin oxides
dc.subjectFinite conductivity
dc.subjectCurrent transfer
dc.subjectIndium tin oxide
dc.subjectInGaN/GaN
dc.subjectIngan/gan lightemitting diodes (LEDs)
dc.subjectInter-digitated electrodes
dc.subjectLight output power
dc.subjectLight emitting diodes
dc.subject.scopusFlip Chip; Extraction Efficiency; Light Emitting Diodes
dc.subject.wosPhysics, condensed matter
dc.titleThe role of ITO resistivity on current spreading and leakage in InGaN/GaN light emitting diodes
dc.typeArticle
dc.wos.quartileQ3
dspace.entity.typePublication
local.contributor.departmentMühendislik Fakültesi/Elektrik ve Elektronik Mühendisliği Bölümü
local.indexed.atScopus
local.indexed.atWOS

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