Publication:
A brief survey and economical analysis of air cooling for electronic equipments

Simple item page
dc.contributor.buuauthorEtemoğlu, Akın Burak
dc.contributor.departmentMühendislik Fakültesi
dc.contributor.departmentMakina Mühendisliği Bölümü
dc.contributor.orcid0000-0001-8022-1185
dc.contributor.researcheridABE-9423-2020
dc.contributor.scopusid8221881000
dc.date.accessioned2022-09-14T10:46:43Z
dc.date.available2022-09-14T10:46:43Z
dc.date.issued2007-01
dc.description.abstractThe techniques used in the cooling of electronic equipments vary widely depending on the particular application. Cooling with liquids and impinging air jets become important where classical cooling techniques may be insufficient, while a single or array jet is employed where highly localised cooling is desired. This paper provides a comparative survey of advanced methods of cooling for electronic systems and an economical analysis of cooling electronic equipments using slot and circular jets.
dc.identifier.citationEtemoğlu, A. B. (2007). "A brief survey and economical analysis of air cooling for electronic equipments". International Communications in Heat and Mass Transfer, 34(1), 103-113.
dc.identifier.endpage113
dc.identifier.issn0735-1933
dc.identifier.issue1
dc.identifier.scopus2-s2.0-33846013242
dc.identifier.startpage103
dc.identifier.urihttps://doi.org/10.1016/j.icheatmasstransfer.2006.08.005
dc.identifier.urihttps://www.sciencedirect.com/science/article/pii/S0735193306001552
dc.identifier.urihttp://hdl.handle.net/11452/28712
dc.identifier.volume34
dc.identifier.wos000244165800012
dc.indexed.wosSCIE
dc.language.isoen
dc.publisherPergamon-Elsevier Science
dc.relation.journalInternational Communications In Heat And Mass Transfer
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.subjectEconomical analysis
dc.subjectAir
dc.subjectElectronic cooling
dc.subjectImpinging jets
dc.subjectCooling
dc.subjectEconomics
dc.subjectElectronic equipment
dc.subjectJets
dc.subjectConvective heat-transfer
dc.subjectArray
dc.subjectEvolution
dc.subjectModules
dc.subject.scopusJet Impingement; Heat Transfer; Swirling
dc.subject.wosThermodynamics
dc.subject.wosMechanics
dc.titleA brief survey and economical analysis of air cooling for electronic equipments
dc.typeArticle
dc.wos.quartileQ2
dspace.entity.typePublication
local.contributor.departmentMühendislik Fakültesi/Makina Mühendisliği Bölümü
local.indexed.atScopus
local.indexed.atWOS

Files

License bundle

Now showing 1 - 1 of 1
Placeholder
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed upon to submission
Description:
Download

Collections

İndeksli Yayınlar / Indexed Publications