Computational thermal analysis of cylindrical fin design parameters and a new methodology for defining fin structure in LED automobile headlamp cooling applications

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dc.contributor.authorSökmen, Kemal Furkan
dc.contributor.authorYürüklü, Emrah
dc.contributor.buuauthorYamankaradeniz, Nurettin
dc.contributor.departmentUludağ Üniversitesi/Teknik Bilimler Meslek Yüksekokulu/İklimlendirme ve Soğutma Programı.tr_TR
dc.contributor.researcheridAAA-1753-2021tr_TR
dc.contributor.scopusid26645227400tr_TR
dc.date.accessioned2022-12-02T07:40:58Z
dc.date.available2022-12-02T07:40:58Z
dc.date.issued2015-10-15
dc.description.abstractIn this study, the effects of fin design, fin material, and free and forced convection on junction temperature in automotive headlamp cooling applications of LED lights are researched by using ANSYS CFX 14 software. Furthermore a new methodology is presented for defining the optimum cylindrical fin structure within the given limits. For measuring the performance of methodology, analyses are carried out for various ambient temperatures (25 degrees C, 50 degrees C and 80 degrees C) and different LED power dissipations (0.5 W, 0.75 W, 1 W and 1.25 W). Then, analyses are repeated at different heat transfer coefficients and different fin materials in order to calculate LED junction temperature in order to see if the fin structure proposed by the methodology is appropriate for staying below the given safety temperature limit. As a result, the suggested method has always proposed proper fin structures with optimum characteristics for given LED designs. As another result, for safe junction temperature ranges, it is seen that for all LED power dissipations, adding aluminum or copper plate behind the printed circuit board at low ambient temperatures is sufficient. Also, as the ambient temperature increases, especially in high powered LED lights, addition of aluminum is not sufficient and fin usage becomes essential. High heat transfer coefficient and using copper fin affect the junction temperature positively.en_US
dc.description.sponsorshipMagneti Marelli SpAen_US
dc.identifier.citationSökmen, K. F. vd. (2016). "Computational thermal analysis of cylindrical fin design parameters and a new methodology for defining fin structure in LED automobile headlamp cooling applications". Applied Thermal Engineering, 94, 534-542.en_US
dc.identifier.endpage542tr_TR
dc.identifier.issn1359-4311
dc.identifier.scopus2-s2.0-84947997375tr_TR
dc.identifier.startpage534tr_TR
dc.identifier.urihttps://doi.org/10.1016/j.applthermaleng.2015.10.069
dc.identifier.urihttps://www.sciencedirect.com/science/article/pii/S1359431115011163
dc.identifier.urihttp://hdl.handle.net/11452/29651
dc.identifier.volume94tr_TR
dc.identifier.wos000370770300055tr_TR
dc.indexed.scopusScopusen_US
dc.indexed.wosSCIEen_US
dc.language.isoenen_US
dc.publisherElsevieren_US
dc.relation.collaborationYurt içitr_TR
dc.relation.journalApplied Thermal Engineeringen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergitr_TR
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectThermodynamicsen_US
dc.subjectEnergy & fuelsen_US
dc.subjectEngineeringen_US
dc.subjectMechanicsen_US
dc.subjectAutomotive LED lighting systemsen_US
dc.subjectLaminar natural convectionen_US
dc.subjectHeat sinksen_US
dc.subjectComputational fluid dynamics (CFD)en_US
dc.subjectAluminumen_US
dc.subjectApplication programsen_US
dc.subjectComputational fluid dynamicsen_US
dc.subjectCopperen_US
dc.subjectElectric lossesen_US
dc.subjectFins (heat exchange)en_US
dc.subjectHeadlightsen_US
dc.subjectHeat transferen_US
dc.subjectHeat transfer coefficientsen_US
dc.subjectPrinted circuit boardsen_US
dc.subjectPrinted circuitsen_US
dc.subjectStructural optimizationen_US
dc.subjectTemperatureen_US
dc.subjectThermoanalysisen_US
dc.subjectCooling applicationsen_US
dc.subjectHigh heat transfersen_US
dc.subjectJunction temperaturesen_US
dc.subjectLED lighting systemen_US
dc.subjectLow ambient temperaturesen_US
dc.subjectTemperature increaseen_US
dc.subjectTemperature limitsen_US
dc.subjectLight emitting diodesen_US
dc.subject.scopusPower Semiconductor Diodes; Heat Sinks; Hot Temperatureen_US
dc.subject.wosThermodynamicsen_US
dc.subject.wosEnergy & fuelsen_US
dc.subject.wosEngineering, mechanicalen_US
dc.subject.wosMechanicsen_US
dc.titleComputational thermal analysis of cylindrical fin design parameters and a new methodology for defining fin structure in LED automobile headlamp cooling applicationsen_US
dc.typeArticle
dc.wos.quartileQ2en_US

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